Free rapid Practical Guide to the Packaging of Electronics

Dr. Jamnia has published a large number of engineering papers and presentations as well as nontechnical articles. He also has a number of patents and patent applications. He has a demonstrated basic understanding of engineering principles, particularly in the areas of fluid flow, heat transfer, and solid mechanics and stress analysis. Herein, I have not set forth to bring together the latest and most accurate techniques or to cover all aspects of electronics packaging. My goal has been to develop a book that can be read (and comprehended) either in a week’s time or over a few weekends. And it provides the basics that an engineer—mechanical, biomedical, or electrical—needs to keep in mind when designing a new system or troubleshooting a current one. Furthermore, this book serves program and engineering managers, as well as quality assurance directors to refresh their basics every once in a while. I hope that this work is of service to them as well. This work is based on my seminar notes that the Society of Automotive Engineers has sponsored.

Uploading links
Rapid links